With data access becoming increasingly ubiquitous, and the amount and variety of value-added services increasing daily, one question continues to grow in importance in the wireless world: what will be the future role of operators? How will they benefit from the growth in wireless they’ve done so much to drive?...
BLOG / Oct 2014 / Posted By: sstocker
FDD, Full Duplex, is a hot topic in the 3GPP and IEEE 802.11 worlds. Yesterday, the 3G4G Blog, a UK-based blog investigating topics of interest to the wireless engineering community, published a post titled ‘Real’ Full Duplex (or No Division Duplex – NDD?) covering FDD from various perspectives. InterDigital engineer...
BLOG / Oct 2014 / Posted By: sstocker
InterDigital is an executive sponsor and key sponsor at the Telecom Council of Silicon Valley, which this week is hosting its flagship annual event, TC3 (Telecom Council Carrier Connections). Bringing together Bay Area representatives from major operators, device companies and application providers worldwide, TC3 is a showcase for operator requirements,...
BLOG / Sep 2014 / Posted By: sstocker
Three professors from Columbia University, in collaboration with InterDigital’s Dr. Ariela Zeira as the industrial principal co-investigator, have been awarded a $750,000 three-year grant from the National Science Foundation (NSF) Enhancing Access to the Radio Spectrum (EARS) Program for a project titled “Low-Power, Multi-Tiered, Shared-Spectrum Access Terminals using Compressive Scanning...
BLOG / Sep 2014 / Posted By: sstocker
PIMRC‘14 (IEEE 25th Annual International Symposium on Personal, Indoor and Mobile Radio Communications), which ran from September 2-5 in Washington, DC, was a huge success, and InterDigital is proud to have been a significant contributor. The conference was focused on 5G technologies, aligning closely with our own focus. Conference topics...
Byung K. Yi, InterDigital’s Chief Technology Officer and Executive Vice President, InterDigital Labs, spoke as a panelist during the Smart Cloud Show, a leading technology conference hosted in South Korea by Chosun Biz, a top business publication in the region. The conference, which is open September 2-4, is focused on...
BLOG / Aug 2014 / Posted By: mcarney
Recently in July, at the 18th JCT-VC meeting, the 9th JCT-3V meeting, the 109th MPEG meeting, and the ITU-T SG16 meeting, the 2nd edition of the HEVC standard was completed.  This 2nd edition has been approved by ITU-T, and is currently under ballot in ISO/IEC. This is a significant milestone...
BLOG / Aug 2014 / Apps, Connectivity, VentureBeat, Wireless Networks / Posted By: mcarney
We’ve all been there, while attending a major event you snap a picture to capture a big moment and want to share that photo with friends, family and your social network. Unfortunately, so does everyone else.  With the increased traffic, wireless networks become congested and connectivity becomes nearly impossible. Our...
BLOG / Aug 2014 / IEEE, IoT, M2M, oneM2M, SDN / Posted By: mcarney
In the July issue of IEEE Wireless Communications Magazine, Alex Reznik, Senior Principal Engineer, InterDigital Labs, participated as a guest editor for the Feature Topic entitled, Research and standards: Leading the evolution of telecom network architectures.  In total, 38 papers were submitted, all focused on ways to rethink mobile network...
BLOG / Aug 2014 / H.265, HEVC, SHVC, UHD / Posted By: sstocker
In the July-September issue of IEEE MultiMedia magazine, InterDigitals’ Yan Ye co-authored a paper exploring “The Scalable Extensions of HEVC for Ultra-High-Definition Video Delivery.” This invited article addresses the current trends in the video delivery marketplace, including the anticipated increase of UHD content being delivered to consumers. Scalable video coding...